Digital image correlation (DIC) is a high-precision optical metrology technology that tracks speckle patterns applied to the surface of a measurement target to measure 2D/3D deformation and strain in full field. Its non-contact nature makes it a powerful solution widely used across modern engineering, manufacturing and research. More than just a measurement technology, DIC is a key technology that revolutionizes the entire product development, verification, production, quality control cycle. Its accuracy, flexibility, scalability and digital compatibility have made it an essential tool across diverse industries. The presentation will introduce and describe the benefits of DIC technology, including non-contact (safe measurement of even sensitive or fragile specimens), full-field data (capable of identifying strain concentrations, cracks and localized behavior), high-speed measurement (used for shock, vibration and high-strain-rate experiments), wide strain range support, design and model verification advantages, and application to a wide range of materials.